On June 25, IBM announced a significant breakthrough in semiconductor technology with the introduction of the world's first 'sub-nanometer' chip process technology. This technology employs a revolutionary 'three-dimensional vertical stacking' transistor architecture, directly achieving a 0.7-nanometer node. Leveraging this new 3D architecture, IBM successfully integrated nearly 100 billion transistors on a chip the size of a fingernail, doubling the transistor density compared to the 2-nanometer chip introduced in 2021.
