BOE A has issued a statement on its investor relations activities record, revealing that its pilot line for glass substrate packaging carrier plates is anticipated to attain fully automated equipment operation by the first half of 2026, boasting a designed monthly production capacity of 1,000 units. Presently, the company has achieved mastery over the entire manufacturing process, encompassing TGV via formation, deep via copper filling, build-up layers, and wiring techniques. In 2025, BOE A successfully developed samples of large-sized, high-layer-count (9-2-9, 20-layer) glass substrate carrier plates. These samples have been dispatched to several domestic customers for evaluation purposes. Notably, some customers have successfully completed conceptual certification and have advanced to the technical testing phase. However, mass production and revenue generation from volume production have not yet commenced. Furthermore, the company's total depreciation expenses are projected to commence a decline starting from 2025, with future capital expenditures also expected to decrease progressively. As of now, there are no intentions to issue equity.