Search
Manst Clarifies: No Involvement in HBM Storage Chip Packaging or CPO Optical Module Applications at Present
6 day ago /
Read about 0 minute
Author：小编
On June 25, when addressing an investor's query regarding whether the company's coating technology could be applied to the high-profile sectors within the AI industry chain—specifically, HBM storage chip packaging and CPO optical modules—Manst provided a clear response on the interactive platform. The company stated that its current product lineup does not encompass these particular applications. Furthermore, Manst cautioned investors to remain vigilant and considerate of potential investment risks.
-
C114 Communication Network -
Communication Home
7 X 24 Track global technological trends
