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TSMC Expands US Packaging and Testing Alliance, Reveals Unprecedented 10-Year Agreement with Industry Second-Place Player Amkor
17 hour ago /
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Author：小编
On June 16 local time, TSMC and Amkor, the world's second-largest semiconductor packaging and testing company, announced a 10-year cooperation agreement aimed at enhancing advanced semiconductor packaging capabilities in Arizona, USA, and accelerating investment in the semiconductor supply chain. The agreement establishes a framework for TSMC to procure Amkor's advanced packaging and testing services, with both parties working together to expand capacity and build a more efficient and resilient supply chain to meet customers' evolving needs.
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