Search
Sources from the equipment sector have disclosed that TSMC has recently shared its 'CoWoS Glass Substrate Development Blueprint' with its supply chain partners. The semiconductor giant will team up with ABF substrate maker Ibiden and panel producer Innolux to collectively assess the viability of integrating glass substrates into CoWoS advanced packaging solutions. This move signifies TSMC's inaugural public revelation of the progress in applying glass substrate technology, as glass substrates now officially embark on the industrial verification phase. Nonetheless, large-scale production of glass substrates remains a prospect for the future. TSMC has emphasized the necessity for additional research and validation concerning glass thickness and the configuration of extensive CoWoS packaging setups down the line.
-
C114 Communication Network -
Communication Home
