On June 15, Suanmiao Technology made a significant announcement regarding the successful tape-out of its fully indigenous and self-developed 3D TokenPU chip. This chip features a cutting-edge 3D hybrid stacking architecture, which enables it to achieve an impressive ultra-large bandwidth of 16TB/s. With a specific focus on delivering outstanding inference performance for large-scale models, this breakthrough represents a pivotal step in localization efforts. Furthermore, it offers a fresh and innovative indigenous hardware solution to meet the computational demands of large-scale models.
