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On June 12, during an investor relations event, BOE unveiled the technical roadmap and investment strategy for its glass substrate packaging carrier plate sector. This business venture embarked on its technical research journey in 2020 and made a significant investment of RMB 390 million in 2022 to set up a wafer-level innovation experimental platform that accommodates both glass and silicon substrates. In 2024, BOE furthered its commitment by investing an additional RMB 993 million to construct a pilot line for panel-level glass carrier plates. The company anticipates finalizing the installation and commissioning of the primary equipment by 2025, and achieving full automation and operational status of the pilot line in the first half of 2026, with a designed monthly production capacity of 1,000 wafers.
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