TSMC Ramps Up Monthly 3nm Production to 175,000 Wafers, Yet Falls Short of AI Chip Demand, Contemplating Price Hikes of Up to 15%
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Author:小编   

Leveraging the robust demand in the fields of artificial intelligence (AI) and high-performance computing (HPC), TSMC reported a remarkable revenue figure for May, reaching NT$416.975 billion (approximately RMB 89.399 billion). This represents a significant year-on-year surge of 30.09%, setting a new monthly revenue record for the company. At the shareholders' meeting, TSMC's President, Wei Zhejia, emphasized the strength of AI demand and expressed the company's commitment to avoiding becoming a bottleneck in the supply chain. He also voiced unwavering confidence in the growth trajectory of the AI industry over the coming years.

Despite TSMC's proactive measures to bolster production capacity, the supply pressures for advanced manufacturing processes persist unabated. The capacity utilization rate at Fab18, TSMC's state-of-the-art 3nm facility located in the Tainan Science Park, continues to operate at peak levels. By early 2026, the monthly production capacity for 3nm wafers is projected to reach approximately 130,000 units, with further expansion anticipated to between 160,000 and 175,000 wafers in the second quarter. However, the exponential growth in AI demand has far outstripped initial projections, leaving the issue of customers vying for limited production capacity unresolved.

In response to these market dynamics, TSMC has announced plans to implement another round of price increases for its 3nm foundry services in the latter half of 2026, with hikes reaching up to 15%. Moreover, there is a possibility of an additional 5% to 10% increase in 2027. This pricing strategy underscores a fundamental transformation in the supply-demand landscape for advanced manufacturing processes within the AI-driven era.