Corelink Integrated Circuits is set to ink a joint venture framework agreement with the Hangzhou-Shaoxing Airport Economic Zone, aiming to jointly establish Corelink Advanced Integrated Circuit Manufacturing (Shaoxing) Co., Ltd. This newly formed company will act as the executing body for Corelink's 12-inch automotive-grade digital-analog mixed-signal chip manufacturing project. It will construct a 12-inch integrated circuit production line specifically tailored for automotive-grade digital-analog mixed-signal chips, boasting a monthly production capacity of 50,000 wafers. The primary technological and product focuses of this production line encompass 40/28nm MCU/DSP, 90/55nm BCD/DrMOS, and other analog circuits, as well as 55nm silicon photonics/laser driver chips, among others. The total projected investment for this project stands at around 20 billion yuan, with a capital commitment of 12 billion yuan, out of which Corelink Integrated Circuits plans to contribute 3.012 billion yuan.