On June 11, sources revealed that Corelink Integrated Circuit has forged a partnership with the Management Committee of the Shaoxing Area within the Hangzhou-Shaoxing Airport Economic Integration Development Demonstration Zone. The collaboration culminated in the signing of a joint venture framework agreement, aimed at co-operating Corelink Advanced Integrated Circuit Manufacturing (Shaoxing) Co., Ltd. As part of this agreement, Corelink Integrated Circuit will inject 3.012 billion yuan, securing a 25.1% equity stake in the newly formed joint venture. The overarching project, with an estimated total investment of around 20 billion yuan, is earmarked for the establishment of a cutting-edge 12-inch integrated circuit production line. This line will be specifically tailored for the manufacture of automotive-grade digital-analog hybrid chips, boasting a monthly production capacity of 50,000 wafers. The production line's core technological and product focus will encompass 40/28nm MCU/DSP, 90/55nm BCD/DrMOS, along with other analog circuits, as well as 55nm silicon photonics/laser driver chips.