On June 9th, Empyrean announced via an interactive platform that its state-of-the-art packaging EDA platform is now equipped to support Chiplet design for cutting-edge AI chips, GPUs, and high-performance processors. This advancement tackles the complexities associated with ultra-large-scale layout design and physical verification within advanced packaging processes, significantly boosting design efficiency. In tandem, the company has crafted a holistic solution that spans the entire workflow, from collaborative design to the verification of heterogeneous integrated three-dimensional chips. This breakthrough fills a critical void in China's high-end 3DIC design tools landscape. Empyrean has emerged as the sole domestic provider of a full-process EDA solution tailored for 3DIC design verification, and has proudly unveiled its inaugural Argus 3DIC physical verification platform.