On the morning of June 6th, an investment agreement was inked between the Haimen Economic and Technological Development Zone and Ying'erjie Semiconductor Technology Co., Ltd., officially setting the wheels in motion for an advanced packaging project. This ambitious endeavor is projected to achieve an annual production capacity of 5 billion high-end chips, backed by a substantial total investment of 500 million yuan. Shen Xudong, the district party secretary, graced the signing ceremony with his presence and held a meeting with Li Wei, the chairman of Ying'erjie, along with his delegation.

Previously, Ying'erjie had already made significant strides in Haimen by investing in and establishing a semiconductor grinding and dicing factory, which commenced operations in 2024. Through relentless process innovation, the factory has witnessed a notable enhancement in both its production capacity and yield rate, with its product portfolio spanning across multiple domains. The inauguration of this new project is poised to further solidify Ying'erjie's comprehensive industry chain layout in Haimen, marking a significant milestone in its strategic expansion.