Search
During investor research, Medtec disclosed its progress in product development and mass production in advanced packaging technologies such as glass substrates and TGV (Through Glass Via), as well as in fields like AI/AR and semiconductor optics. The semiconductor process bonded prisms developed by the company have entered mass production, with output rapidly increasing, and capacity is expected to further expand by 2026. Meanwhile, the company has made significant progress in areas such as MicroLED and uncooled infrared sensor chips, with the potential to achieve substantial capacity growth by 2026. Additionally, Medtec has mastered the TGV process, possessing large-scale panel-level processing capabilities, providing crucial technical support for AI chip 2.5D/3D Chiplet packaging.
-
C114 Communication Network -
Communication Home
