Zhongfu Circuit: Plans to raise no more than 850 million yuan through private placement for projects such as the renovation and expansion of AI PCB production lines
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Author:小编   

On May 29, Zhongfu Circuit announced its plan to raise no more than 850 million yuan through private placement. After deducting issuance expenses, the funds will be used for the renovation and expansion of the Heshan Zhongfu AI PCB production line, digital upgrade construction, and supplementary working capital.