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In the realm of AI competition, computing power has shifted from being a mere option to an absolute necessity. The escalating demand for generative AI and high-performance computing has placed significant strain on chip bandwidth, power consumption, and integration density. Amidst this scenario, advanced packaging technology has transformed from a conventional backend support function into a pivotal avenue for overcoming computing power constraints. Harnessing its distinctive Panel Level Packaging (PLP) technology, CR Micro has crafted cutting-edge packaging solutions that boast high integration and exceptional thermal dissipation for AI power supplies, optical modules, and solid-state transformers. As CR Micro progresses from technological innovation to industrialization, its developmental trajectory is becoming ever more defined.
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