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Citi: Advanced Packaging Equipment Providers to Benefit from Huawei's New Chip Design Approach
8 hour ago /
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Author：小编
Analysts from Citi pointed out that advanced packaging equipment and service providers, particularly manufacturers of hybrid bonding equipment, are likely to be the primary beneficiaries of Huawei's new chip design approach. Meanwhile, the increased packaging complexity will also benefit outsourced chip assembly and test providers.
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