On May 25, 2026, at the ISCAS 2026 conference, Huawei unveiled a set of innovative principles aimed at steering the semiconductor industry forward—dubbed Tao's Law (τ). This groundbreaking concept advocates for a paradigm shift from 'geometric miniaturization' to 'time miniaturization.' By leveraging cutting-edge technologies such as logic folding, it seeks to minimize signal propagation delays, thereby elevating transistor density and fostering the continual advancement of semiconductor and electronic systems. Huawei has constructed a multi-tiered collaborative optimization framework that spans device, circuit, chip, and system levels. Through meticulous optimization of transistors, interconnect resistance, and parasitic capacitance, coupled with the application of logic folding technology, full-stack software-hardware-chip co-design, and the introduction of the Lingqu bus, the company systematically diminishes the time constant τ. This approach enhances performance, energy efficiency, and transistor density across all levels. Building on the foundation of Tao's Law (τ), Huawei has successfully designed and mass-produced 381 chip models in the past six years. Notably, the Kirin chip, slated for release in autumn 2026, stands as the pioneer in adopting logic folding technology, marking a significant leap in performance. It is anticipated that by 2031, the transistor density of high-end chips based on Tao's Law (τ) will rival that of the 1.4-nanometer process.