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On May 26, 2026, SK Hynix released the temperature-controlled thermal dissipation memory technology iHBM. By integrating Integrated Cooling Elements (ICE) within the high-bandwidth memory package, it directly constructs dedicated heat exhaust channels in the D2D PHY area where heat is concentrated, reducing thermal resistance by over 30% and ensuring product stability in high-temperature, high-load environments. This technology employs the MR-MUF wafer-level packaging process, enabling scalable mass production and compatibility with existing system-in-package environments without requiring extensive design modifications. SK Hynix plans to apply it to next-generation products such as HBM5 to meet the thermal dissipation needs of high-performance computing and AI data center scenarios.
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