On May 26th, Kingbrother shared insights during its performance briefing, revealing that the company specializes in electronic interconnection and packaging technologies. It is dedicated to cultivating expertise in PCB, IPDM, and associated pilot-scale and engineering services. Its operations span a wide array of sectors, including artificial intelligence, information technology, industrial control, automotive electronics, and medical equipment. Notably, Kingbrother does not directly participate in the design and production of semiconductors, memory devices, or memory chips. Instead, it capitalizes on its strengths in electronic interconnection, packaging substrates, PCB design, simulation analysis, as well as prototype and small-scale production to offer comprehensive support services to clients throughout the R&D, pilot-scale, and engineering phases.

The company is actively driving technological R&D and enhancing product capabilities for high-end specialized products, particularly packaging substrates. Moreover, it is engaged in technological research and product development for chip packaging substrates in the storage and RF domains, along with multilayer ultra-high-density interconnection carriers. These efforts have culminated in the successful delivery of prototypes and small-batch orders. Although these capabilities hold potential for application in industry chain segments such as semiconductors and high-speed communications, they are presently in the midst of product R&D iteration and customer base expansion. Consequently, their impact on the company's overall revenue and operational performance remains limited at this juncture.