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On May 25, 2026, at the 2026 International Symposium on Circuits and Systems, He Tingbo, the Director and President of Huawei’s Semiconductor Business Department, officially introduced ‘Tao’s Law (τ)’. This groundbreaking principle advocates for a shift from ‘geometric miniaturization’ to ‘time miniaturization’, leveraging cutting-edge technologies like logic folding to reduce signal propagation delays, boost transistor density, and foster ongoing progress in semiconductor technology. Guided by this law, Huawei has already engineered and commenced mass production of 381 chip models. Projections indicate that by 2031, the transistor density of high-end chips developed in accordance with this law will achieve a level comparable to that of the 1.4-nanometer process.
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