On May 25, 2026, during the 2026 International Symposium on Circuits and Systems (ISCAS 2026), He Tingbo, a Huawei director and also the president of the Semiconductor Business Department, officially put forward the 'Tao (τ) Law'. This groundbreaking law marks a paradigm shift, substituting the traditional concept of 'geometric miniaturization' with 'temporal miniaturization'. It strives to minimize signal propagation delays and elevate transistor density by leveraging cutting-edge technologies like logic folding. Through these innovations, it propels the relentless advancement of semiconductors and electronic systems. Based on this law, Huawei has already embarked on the design and mass production of 381 chip models, spanning a diverse array of fields. It is anticipated that by 2031, the transistor density of high-end chips developed in accordance with the Tao Law will achieve a level equivalent to that of the 1.4-nanometer process.