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TERA Laser: Shipping of Through-Glass Via Equipment for Panel-Level Glass Substrates Announced
1 day ago /
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Author：小编
On an interactive platform, TERA Laser announced that its TGV laser microvia equipment, which incorporates a precision control system and laser modification technology, is capable of performing microvia and micro-groove processing on glass substrates made from various materials. This technology finds its primary applications in areas such as semiconductor chip packaging and display chip packaging. At present, the company has attained full-scale coverage of laser technology for both wafer-level and panel-level TGV packaging, and has successfully completed the shipment of its through-glass via equipment tailored for panel-level glass substrates.
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