On May 25, during the IEEE International Symposium on Circuits and Systems (ISCAS 2026), He Tingbo, a member of Huawei's board of directors and president of its Semiconductor Business Department, delivered a keynote address. In this speech, he officially introduced a groundbreaking principle set to shape the future of the semiconductor industry—Tao's Law (τ Law).

This innovative law suggests a paradigm shift from the traditional focus on 'geometric miniaturization' to a new approach centered on 'temporal miniaturization' for the evolution of semiconductors and electronic systems. By leveraging cutting-edge technologies such as logic folding, Tao's Law aims to minimize signal propagation delays and boost transistor density, thereby fostering ongoing advancements in system performance.

Tao's Law establishes a comprehensive, multi-level collaborative optimization framework that spans from individual devices to entire systems. It achieves breakthroughs beyond conventional planar layouts by optimizing transistor and interconnect resistance, as well as parasitic capacitance. This enables a full-stack, collaborative design approach integrating software, hardware, and chips, while also redefining computing system interconnection protocols to systematically reduce the time constant τ.

Building on this principle, Huawei has successfully designed and mass-produced 381 chip models, catering to diverse applications in mobile phones and AI computing. Looking ahead, it is anticipated that by 2031, high-end chips developed under the guidance of Tao's Law will achieve a transistor density comparable to that of a 1.4-nanometer process, marking a significant milestone in semiconductor technology.