Confronted with persistent technological barriers, Huawei has forged ahead with a significant advancement in storage technology, leveraging its proprietary Die-on-Board (DoB) packaging technique. This method involves directly soldering NAND dies onto PCB substrates, eliminating the need for separate packaging processes. By doing so, it surpasses the conventional 16-layer stacking constraint, enabling the stacking of up to 36 layers. This breakthrough yields a 33% boost in unit space capacity density while simultaneously reducing production expenses. Presently, Huawei has successfully commenced mass production of 61.44TB and 122.88TB high-capacity SSDs, with plans underway for a 245TB variant. These cutting-edge products have already found application in enterprise-level storage solutions, delivering an impressive raw capacity of up to 4.42PB within a compact 2U space. This achievement paves the way for domestic storage solutions to circumvent the limitations imposed by 3D NAND layer counts.