BOE A has recently announced the signing of a three-year memorandum of cooperation with Corning Incorporated. This strategic partnership will primarily focus on collaborative efforts in several key areas, including glass substrate packaging substrates, foldable glass, perovskite glass substrates, and applications in optical interconnects. Specific terms and details of the cooperation are set to be further discussed and finalized in a separate agreement.

BOE A clarified that the businesses involving glass substrate packaging substrates, perovskite technology, and optical interconnects have not yet generated revenue from mass production and are currently facing significant uncertainties. In 2024, BOE A made a substantial investment of RMB 993 million to set up a pilot line dedicated to glass substrate packaging substrates. Samples from this line have already been dispatched to several domestic customers, with some successfully passing the conceptual certification stage and now undergoing technical testing.

Furthermore, a subsidiary of BOE A invested in the establishment of a MicroLED chip production line in 2023. As a result, MicroLED optical interconnect chips have been successfully sampled and delivered to customers for evaluation.

In the realm of perovskite technology, BOE A has made significant strides since 2024, establishing three major R&D platforms: a glovebox (25mm*25mm) for controlled environment experiments, a pilot line (300mm*300mm) for small-scale production testing, and a pilot-scale production line (1200*2400mm) for larger-scale manufacturing trials. These platforms are employing parallel development strategies, utilizing rigid, flexible, and tandem module technology routes. The cumulative investment across these three platforms amounts to nearly RMB 1 billion.