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Intel's Glass Substrate Technology Prototype Unveiled, Paving the Way for Commercial Use in 2030
10 hour ago /
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Author：小编
At the Optical Fiber Communication Conference 2026 (OFC 2026), the first batch of chip prototypes featuring glass core substrates and integrated co-packaged optics (CPO) technology made their public debut, providing a direct glimpse into the potential packaging forms of future high-performance and artificial intelligence chips. The on-site photos, captured by Ian Cutress from More Than Moore, revealed that these prototypes belong to active optical packaging (AOP) utilizing glass core substrates, aiming to demonstrate the technological direction for next-generation high-computing-power packaging.
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