On May 20, Focuslight Technologies announced on an interactive platform that the high-performance heat dissipation substrate materials it has developed are of immense application value in resolving the thermal challenges associated with External Laser Sources (ELS) in Co-Packaged Optics (CPO) systems. Drawing on the company's profound technological know-how in high-power semiconductor laser substrates, these materials facilitate the cross-industry utilization of the technology platform. Their goal is to fulfill the thermal management demands in high-power-density scenarios pertinent to optical communications. Presently, CPO technology is still undergoing swift development, especially concerning industry chain standards and customer requirements. Focuslight Technologies is proactively working in tandem with downstream customers to drive forward solution integration and technical validation. The speed of business execution is contingent upon the advancement of technology commercialization and customer demand.