According to foreign media reports citing a Bernstein analysis, despite anticipation surrounding foundry collaboration between Apple and Intel, Intel is unlikely to disrupt TSMC’s dominance in the high-end chip foundry market in the near term. This is attributed to the relatively small scale of Apple’s orders and persistent technological gaps between the two companies. The report highlights that Intel has yet to close the technological divide with TSMC. Apple intends to utilize Intel’s 18A-P process for manufacturing the entry-level M7 chip starting in 2027, with the possibility of adopting the same process for the A21 chip, slated for release in 2028. Apple has already secured samples of the 18A-P process design kit. Furthermore, the partnership between the two firms may extend to Apple’s custom ASIC chips tailored for data centers and AI servers. Bernstein notes that Samsung’s foundry technology trails behind TSMC’s, with TSMC currently being the sole provider capable of true mass production of 2nm chips. Orders placed with Samsung and Intel are largely influenced by geopolitical factors and efforts to diversify supply chains. In terms of cutting-edge advanced processes, TSMC continues to lead the industry. Industry indicators suggest that AMD has allocated a portion of its 2nm CPU orders to Samsung, while TSMC is reinforcing its market position through significant capital investments. Institutional insights conclude that Apple’s collaboration with Intel forms part of a broader supply chain hedging and diversification strategy. However, the volume of orders is insufficient to reshape the competitive dynamics within the industry.