Recently, during institutional research, Lion Microelectronics disclosed that the company is currently inundated with orders for its 12-inch heavily doped silicon wafers. Owing to constrained production capacities, the company is experiencing delivery delays, particularly for its low-resistivity products. At present, Lion Microelectronics stands at the forefront of technology within the heavily doped silicon wafer sector. The company's related expansion projects are advancing steadily, though it has no immediate plans for substantial new investments. Additionally, the company's product lineup, including lightly doped boron epitaxial wafers tailored for logic circuits, commands significant bargaining power in the market. Moreover, lightly doped epitaxial wafers designed for 28nm logic circuits have commenced bulk shipments. Notably, Lion Microelectronics' VCSEL chip technology ranks among the global elite, and it is projected that shipments will witness a surge by 2026.