The burgeoning global demand for AI computing power is propelling enhancements in semiconductor advanced packaging technologies. South Korea's SK Group, leveraging its subsidiary SKC, is in the process of raising 5.3 billion yuan to concentrate on the large-scale production of glass substrates. In collaboration with TSMC and Innolux, SK Group aims to forge a formidable 'packaging iron triangle'. Glass substrates, prized for their low dielectric loss and exceptional heat resistance, have emerged as the pivotal material for overcoming the performance constraints of AI chips. Absolix, a subsidiary of SKC, has pioneered the establishment of the world's inaugural glass substrate factory. Its samples are currently undergoing rigorous testing by industry behemoths such as AMD and AWS. If the samples pass the certification, mass production could potentially commence as early as the end of 2026. This strategic initiative is poised to reconfigure the capacity channels and cost frameworks of high-end AI chips. TSMC has designated this technology as CoPoS, with the ambition of supplanting traditional silicon interposers. Global semiconductor titans are expediting their deployments, with Intel already engaged in the mass production of glass substrate processors, while Samsung Electro-Mechanics and LG Innotek are intensifying their R&D endeavors. SK Group's investment is strategically positioned to seize the initiative in materials, solidify its strategic standing within the AI semiconductor supply chain, and potentially revolutionize the advanced packaging industry landscape through its collaboration with TSMC and Innolux.