From May 14 to 16, the 2026 Hangzhou International Semiconductor and Integrated Circuit Industry Innovation Exhibition (Hangzhou Changxin Expo) took place at the Hangzhou Grand Convention and Exhibition Center. Centered around the theme of "Connecting the Chip Ecosystem, Unleashing New Prospects in Intelligent Manufacturing," this expo offered an in-depth exploration of the entire semiconductor industry chain. It encompassed various aspects such as chip design, fabrication, packaging and testing, equipment, materials, and applications. Moreover, the expo highlighted state-of-the-art technologies, including third-generation semiconductors, advanced packaging techniques, Chiplet technology, EDA tools, and AI chips.
