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GRINM Advanced Materials: Shipment Volume of Innovative Copper Thermal Conductive Powder for Ascend Chips Remains Steady
2 hour ago /
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Author：小编
Responding to inquiries from investors, GRINM Advanced Materials clarified on the interactive platform that the company's product sales are contingent upon downstream market demand. Presently, the shipment volume of the novel copper thermal conductive powder, specifically designed for Ascend chips, exhibits a relatively stable trend.
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