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Powerchip Technology Corporation Achieves Continuous Advances in Advanced Packaging Sector
2 day ago /
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Author：小编
Recently, Powerchip Technology Corporation has witnessed substantial strides within the realm of advanced packaging. After partnering with TSMC on CoWoS packaging technology, the company has now secured a place in Intel's EMIB advanced packaging supply chain. The projects involved have reached the verification phase, with client demand continuously on the rise. Its 12-inch IPD platform has successfully obtained certification from major international companies and is anticipated to commence mass production from the second quarter of 2026 onwards. Concurrently, Powerchip's collaboration with Micron on HBM (High Bandwidth Memory) is also making steady progress, signaling a notable transformation in the company's operational landscape.
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