Six years following the introduction of DDR5 memory, its successor, the next-generation DDR6 memory standard, has now entered full-fledged development. Samsung, SK Hynix, and Micron have extended invitations to substrate manufacturers to commence advanced development efforts. Currently, initial prototypes are in the process of being produced and rigorously validated. Typically, substrate manufacturers engage in joint development activities two years prior to a product's market release. Therefore, DDR6 is anticipated to make its official debut in 2028. Although the draft standard for DDR6 was unveiled in 2024, JEDEC has yet to finalize the precise specifications. The official standard is expected to be announced either by the end of this year or the following year. DDR6 is designed to substantially enhance memory bandwidth, with speeds projected to double those of DDR5. Additionally, single-module capacities could potentially reach up to 1TB. Initially, DDR6 will be commercialized in the server sector. In contrast, support for consumer platforms may be delayed until AMD launches its Zen8 or Zen9 processors along with the AM6 platform. As for Intel, the earliest support for DDR6 might come from Razer Lake, which could incorporate an NVIDIA RTX GPU to elevate gaming performance.