The IEEE Custom Integrated Circuits Conference (CICC) stands as a leading conference in the realm of integrated circuit design, attracting top-tier global enterprises and universities to exhibit their latest technological advancements. The 2026 edition of CICC took place in Seattle, USA, from April 19th to 23rd. During this event, the research team from Huazhong University of Science and Technology presented two remarkable achievements: one was a chip leveraging the 180nm BCD process, which achieved an impressive 700μV output voltage ripple and attained sub-mV level suppression; the other was an analog-to-digital converter that marked multiple technological breakthroughs. Meanwhile, the Hangzhou Research Institute of Xidian University contributed to the conference by publishing eight papers, covering a range of topics such as 5G millimeter-wave phase shifters, self-powered isolated driver chips, and cutting-edge pipeline analog-to-digital converters. Additionally, the team from Peking University showcased a high-energy-efficiency mixed-architecture spiking neural network chip based on a 22nm process, boasting recognition rates of 98% and 95%.