Hou Yongqing, the Senior Vice President of TSMC, revealed that to meet the soaring demand for artificial intelligence (AI) and high-performance computing (HPC), TSMC is accelerating its expansion efforts at an unprecedented "double speed". This year, an impressive five 2nm wafer fabrication plants (fabs) are set to enter the ramp-up phase, a new record. Consequently, the output of 2nm technology in its inaugural year is anticipated to rise by approximately 45% when compared to the corresponding period for 3nm technology.
