2026 Beijing International Automotive Exhibition | BIWIN Unveils High-Bandwidth, High-Reliability Automotive-Grade UFS 3.1! Accelerating Forward, Responding Steadily to Every Change

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Author：小编

During the 2026 Beijing International Automotive Exhibition, BIWIN proudly presented its automotive-grade UFS 3.1 storage solution, the TAU208. This cutting-edge product embodies a seamless integration of full industry chain technologies, encompassing chip design, firmware algorithms, as well as packaging and testing manufacturing processes. Boasting an impressive high bandwidth of 23.2Gbps and reliability verified by AEC-Q100 Grade 2 certification, the TAU208 offers swift and stable data storage support for intelligent vehicles. It is ideally suited for applications in smart cockpits and autonomous driving scenarios, among others.

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