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The power density of high-performance computing chips continues to rise, making chip-level thermal management a critical issue affecting the performance and reliability of electronic systems. Two-phase cooling, which utilizes the latent heat of phase change for efficient heat transfer, is an important approach for dissipating heat from high-heat-flux electronic devices. However, while traditional water-cooling solutions offer strong heat transfer capabilities, they pose a risk of electrical conductivity. Insulating working fluids, though electrically safe, suffer from low thermal conductivity and limited latent heat of vaporization. Therefore, enhancing two-phase cooling capabilities while ensuring electrical insulation remains a significant challenge in thermal management research.
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