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Successful Delivery of Huahai Qingke's Composite Wafer Thinning Equipment
3 hour ago /
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Author：小编
On April 23rd, Huahai Qingke officially delivered its self-developed composite wafer thinning equipment, the Versatile-GN200. This achievement signifies a significant milestone for the company, marking a crucial breakthrough in the realm of ultra-precision machining for composite semiconductors.
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