Recently, Zhang Xiaoqiang, Deputy Co-Chief Operating Officer of TSMC, revealed at a public forum that the company has no intention of purchasing ASML’s latest High-NA EUV lithography machine at present. This decision stems from the machine’s staggering price tag, which exceeds €350 million (approximately RMB 2.8 billion) per unit—a figure that far outstrips the cost of existing equipment in the semiconductor industry. Zhang emphasized that TSMC’s current EUV equipment remains fully capable of meeting both production and R&D requirements. To further reduce dependency on new tools, TSMC is prioritizing process optimization and has unveiled two advanced processes, A13 and N2U, with production slated to begin in 2029 and 2028, respectively.
