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In a bid to trim expenses, TSMC is set to postpone the rollout of ASML’s state-of-the-art chip fabrication lithography systems beyond 2029—a decision that could potentially deal a significant setback to ASML. TSMC’s Vice Chief Operating Officer, Kevin Zhang, revealed that the company has no current intentions to integrate ASML’s newest high-numerical-aperture extreme ultraviolet (EUV) lithography machines, each commanding a price tag exceeding 350 million euros. In the meantime, TSMC has disclosed that its A13 advanced process chips are slated to commence production in 2029. The company maintains that its existing EUV lithography machines continue to offer a cost-effective solution, whereas the next-generation technology is prohibitively costly.
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