On April 23, TSMC revealed its cutting-edge chip manufacturing technology, asserting that it can craft higher-performance, more compact chips without the need for ASML’s new, costly equipment. As a key chip supplier for a multitude of companies including NVIDIA, Apple, and Google, TSMC highlighted two technological advancements: the A13 technology, slated for production in 2029 and potentially earmarked for AI chips; and the N2U technology, which provides a more economical production solution ideal for chips used in mobile phones, laptops, and AI applications. TSMC intends to maximize the use of its Dutch supplier ASML’s current Extreme Ultraviolet (EUV) lithography tools, opting not to transition to the expensive new generation of High Numerical Aperture (High-NA) EUV lithography systems, each priced at a hefty $400 million, nearly double the cost of the older models. Kevin Zhang, Chief Operating Officer and Senior Vice President of TSMC, remarked that the R&D team has excelled in harnessing the full potential of existing EUV technology, while also charting an ambitious technology scaling path—a move that undoubtedly offers a significant competitive edge.