Intel is set to introduce the Nova Lake-S desktop processor by the end of 2026. This processor, a member of the Core Ultra 400 series, will employ the LGA 1954 socket, ensuring compatibility with currently available coolers. The series will boast configurations with up to 52 cores, encompassing 16 performance cores, 32 efficiency cores, and 4 low-power efficiency cores. Some models in this series will achieve a Thermal Design Power (TDP) of up to 175W. Leveraging TSMC’s cutting-edge N2 manufacturing process, the high-end variants will be outfitted with a generous 288MB of last-level cache (bLLC), support DDR5-8000 memory, and provide 32 PCIe 5.0 lanes.

When it comes to integrated graphics, the standard configuration will incorporate 2 Xe3 cores, whereas a high-performance iteration will be equipped with 12 Xe3P cores. Furthermore, the series will integrate an NPU 6 unit boasting a computational capacity of 74 TOPS, along with support for the AVX10.2 and APX instruction sets. The accompanying 900 series chipsets, including models such as Z970 and Z990, will make their debut, with the Z990 chipset introducing PCIe 5.0 lanes on the chipset side for the first time, marking a significant advancement in connectivity options.