On April 14, news emerged that BYD Company had conducted an inspection and exchange visit to HuiFeng Diamond on April 13. The two entities further solidified their partnership concerning the joint laboratory they established in 2020. They also forged a comprehensive intention for cooperation in the research, development, and industrial utilization of diamond thermal conductivity materials. Utilizing the resources of this laboratory, both parties will concentrate on exploring applications of diamond thermal conductivity, devising highly dependable packaging procedures, advancing new electronic materials, and more. During the meeting, leaders from both companies held in-depth discussions. The collaborative project is anticipated to finalize the construction of a pilot line and attain the capability for mass production support within the current year. Looking ahead, the two parties are also set to delve into more application scenarios for novel materials and construct a cross-border innovation ecosystem, leveraging their combined expertise and resources.