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On April 9, Tongfu Microelectronics unveiled its plan to issue shares to specific investors, aiming to raise a sum not exceeding 4.22 billion yuan (inclusive). Following the deduction of issuance expenses, the proceeds will be fully allocated to projects focused on bolstering packaging and testing capabilities in burgeoning application domains, including memory chips and the automotive industry, as well as in wafer-level, high-performance computing, and communication sectors. Furthermore, the funds will be earmarked for replenishing working capital and repaying bank loans. Prior to the receipt of the raised funds, the company may, based on the actual project requirements, initially utilize its own funds or funds raised through other means, and subsequently substitute them in accordance with pertinent regulations and procedures once the raised funds become available.
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