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TSMC's U.S. Plant to Export 100% of Chips to Taiwan, China: Advanced Packaging Emerges as Next AI Bottleneck
1 day ago /
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Author：小编
For a considerable time in the realm of chip manufacturing, advanced packaging has been somewhat overlooked. However, it has now evolved into a fresh obstacle for AI advancement, while simultaneously serving as a pivotal factor in boosting chip performance and cutting down on expenses.
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