In the artificial intelligence (AI) computing power race, the long-underestimated segment of advanced chip packaging is rapidly emerging as a new bottleneck. Currently, nearly all AI computing chips require packaging before they can be installed in hardware systems such as servers, automobiles, and robots to interact with the external environment. However, the production capacity for this critical process is highly concentrated in Asia, leading to increasingly prominent capacity constraints. With the explosive growth of applications like large AI models, demand for intelligent computing power has surged. Advanced packaging, as a key link in enhancing chip performance in the post-Moore era, is becoming a core battleground in the computing power competition. Through high-density integration and efficient interconnection technologies, it significantly improves the performance and power efficiency of AI chips. However, the tight capacity situation may constrain the rapid development and widespread adoption of AI technologies.