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Intel Seeks Packaging Deals with Major Tech Companies
1 day ago /
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Author：小编
On April 7, 2026, Intel is in negotiations with Amazon and Google regarding advanced semiconductor packaging services, aiming to expand its foundry business and secure major clients through packaging technologies (such as EMIB and EMIB-T). The head of Intel's foundry business stated that packaging could transform the AI revolution in the next decade.
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