Atsuyoshi Koike, the President and CEO of Rapidus, announced that the company is ramping up its efforts in developing cutting-edge process technology. The goal is to narrow the technological gap with TSMC to roughly six months at the 1nm process node. TSMC intends to initially roll out its 1.4nm and 1nm processes at Fab 25, located in the Central Taiwan Science Park. This move involves an estimated investment of approximately $49 billion, with plans to build four wafer fabs. In the first phase, two wafer fabs will be dedicated to the 1.4nm process, with mass production slated for the second half of 2028. Subsequently, the second phase will see a transition to the 1nm process. Meanwhile, Rapidus is set to commence the development of the 1.4nm process this year, with mass production projected for 2029. Moreover, it aims to achieve mass production of the 1nm process between the latter half of 2030 and 2031.