Driven by robust customer demand from industry leaders such as Nvidia, Broadcom, and AMD, Samsung Electronics is anticipated to achieve HBM (High Bandwidth Memory) shipments exceeding 10 billion gigabits by 2026. Hwang Sang-joon, the Executive Vice President in charge of Memory Development at Samsung Electronics, revealed that the company is swiftly ramping up its HBM production capacity. Specifically, they aim to elevate production to more than threefold compared to last year's levels within the current year.
